The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
May. 18, 2023
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Pawel Mrozek, San Jose, CA (US);
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
An element, a bonded structure that includes the element, and methods of forming the same are disclosed. The element can include a nonconductive field region having a surface defining at least a portion of a bonding surface of the element. The surface of the nonconductive field region is prepared for direct bonding. The element can also include a conductive feature having an upper surface that defines at least a portion of the bonding surface of the element, a lower surface opposite the upper surface, and a sidewall that extends between the upper surface and the lower surface. An angle between the upper surface and the sidewall is about 75° or less. The bonded structure includes the element and a second element directly bonded to one another without an intervening adhesive.