The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Mar. 06, 2023
Applicant:
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Inventor:
Cyprian Emeka Uzoh, San Jose, CA (US);
Assignee:
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 80/00 (2026.01); H10W 90/26 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 72/0198 (2026.01); H10W 72/941 (2026.01); H10W 72/944 (2026.01); H10W 72/951 (2026.01); H10W 72/952 (2026.01); H10W 80/011 (2026.01); H10W 80/016 (2026.01); H10W 80/301 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/26 (2026.01); H10W 90/792 (2026.01);
Abstract
Disclosed herein are processes and methods for direct bonding. In some embodiments, the process includes providing an element having a dielectric bonding surface and one or more conductive features exposed at the dielectric bonding surface, where the dielectric bonding surface has a planarity suitable for direct bonding. The process also includes, after providing the element, exposing the dielectric bonding surface to the products of a water vapor plasma prior to direct bonding the element.