Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side. A first electronic component is connected to the substrate top side and having a first electronic component top side distal to the substrate top side. A second electronic is connected to the substrate top side, laterally spaced apart from the first electronic component, and having a second electronic component top side distal to the substrate top side. A lid is connected to the substrate top side, covering the first electronic component and the second electronic component. The lid includes a lid ceiling; and a lid wall extending from the lid ceiling and defining a lid periphery. A dam structure is connected to the first electronic device top side and the lid ceiling within the lid periphery and having a vent. A first interface material is over the first electronic component top side and contained within the dam structure. A second interface material is over the second electronic component top side and connected to the lid ceiling, where the dam structure separates the first interface material from the second interface material. The first interface material has a higher thermal conductivity than the second interface material. Other examples and related methods are also disclosed herein.