The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Oct. 26, 2022
Fuji Electric Co., Ltd., Kawasaki, JP;
Daisuke Inoue, Matsumoto-city, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
There is provided a semiconductor module that can reduce the assembly tolerance between a case part and a base part. A semiconductor module includes: a base part having a plurality of semiconductor elements and a cooling unit configured to cool the plurality of semiconductor elements; a case part attached to the base part and defining a space in which the plurality of semiconductor elements is disposed; a first protruding portion having a shape in which a dimension in a first direction passing through a center of the first protruding portion and a dimension in a second direction crossing the first direction and passing through the center differ from each other, the first protruding portion protruding from the case part toward a side on which the base part is disposed; and a through-hole having an opening being larger than an outer periphery of the first protruding portion and following a shape of the outer periphery of the first protruding portion, wherein the through-hole is formed to pass through the base part and the first protruding portion is inserted into the through-hole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile