The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Aug. 30, 2023
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Riku Katamawari, Nonoichi Ishikawa, JP;
Hideharu Kojima, Kanazawa Ishikawa, JP;
Takeyuki Suzuki, Kaga Ishikawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Toshiba Electronic Devices & Storage Corporation, Kawasaki, JP;
Abstract
A semiconductor device according to the present embodiment includes a lead frame and a semiconductor chip. The lead frame includes a frame main surface and a frame convex portion provided on the frame main surface. The semiconductor chip includes a semiconductor layer and an electrode provided on a bottom surface of the semiconductor layer and bonded to the frame convex portion. The electrode of the semiconductor chip has a protrusion surrounding the frame convex portion, and an outer side surface of the protrusion is flush with a side surface of the semiconductor layer.