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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12751269 B1

PDFFull Text
Date of Patent:
Sep. 29, 2026

Filed:

Jan. 11, 2023

Connecting structure comprising isolation between connecting vias and method for forming the same

Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chia Chen Lee, Taipei City, TW;

Chia-Tien Wu, Taichung City, TW;

Shih-Wei Peng, Hsinchu City, TW;

Kuan Yu Chen, Hsinchu City, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;

Attorneys:

WPAT LAW

Anthony King

Primary Examiner:

Daniel Whalen

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H10W 20/00 (2026.01); H10W 20/42 (2026.01); H10W 20/43 (2026.01);
U.S. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/033 (2026.01); H10W 20/056 (2026.01); H10W 20/076 (2026.01); H10W 20/081 (2026.01); H10W 20/43 (2026.01);
Abstract

A connecting structure includes a first dielectric layer, a first connecting via in the first dielectric layer, a second connecting via in the first dielectric layer, and an isolation between the first connecting via and the second connecting via. The isolation separates the first and second connecting vias from each other. The first connecting via, the isolation and the second connecting via are line symmetrical about a central line perpendicular to a top surface of the first dielectric layer.

Find Patent Forward Citations

Lee, Chia. (2026). Connecting structure comprising isolation between connecting vias and method for forming the same (U.S. Patent No. 12751269). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751269

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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