The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Sep. 23, 2022
International Business Machines Corporation, Armonk, NY (US);
Brent A. Anderson, Jericho, VT (US);
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Reinaldo Vega, Mahopac, NY (US);
Albert M. Chu, Nashua, NH (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnect structure includes a first metal layer comprising at least one metal wire with a first segment and a local extension having a width in a first direction that is larger than a width of the first segment. A second metal layer is on top or below the first metal layer comprising at least one metal wire. A via is connected between the at least one metal wire of the first metal layer and the at least one metal wire of the second metal layer. A width of the via in the first direction is larger than the width of the first segment but smaller than a width of the second segment.