The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Feb. 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chun-Wei Hsu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A chemical mechanical planarization system includes a chemical mechanical planarization head configured to hold a semiconductor wafer during a chemical mechanical planarization process. The system includes a camera positioned to capture an image of the chemical mechanical planarization after chemical mechanical planarization has unloaded the semiconductor wafer. A control system analyzes the image to determine if the chemical mechanical planarization head is damaged. If the chemical mechanical planarization head is damaged, the control system prevents further chemical mechanical planarization operations until the chemical mechanical planarization head is repaired. If the control system does not detect any damage, then the control system permits the chemical mechanical planarization head to receive a next semiconductor wafer for chemical mechanical planarization.