The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

May. 30, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yudong Hao, Fremont, CA (US);

Todd J. Egan, Fremont, CA (US);

Assignee:

Applied Materials, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); G01B 11/00 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
H10P 72/0612 (2026.01); G01B 11/00 (2013.01); G05B 19/41875 (2013.01); G01B 2210/56 (2013.01); G05B 2219/32368 (2013.01);
Abstract

A system can provide in-situ analysis of at least some of a plurality of targets simultaneously during a fabrication process. The system can include a semiconductor processing tool having a chamber. The system can also include a sample arranged within the chamber, the sample having the plurality of targets with different feature orientations and/or feature geometries. The semiconductor processing tool can be configured to perform the fabrication process on the sample. Additionally, the system can include a metrology tool integrated with the semiconductor processing tool. The metrology tool can provide the in-situ analysis of at least some of the plurality of targets simultaneously during the fabrication process.


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