The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
May. 31, 2022
Hefei Boe Ruisheng Technology Co., Ltd., Hefei, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Jie Wang, Beijing, CN;
Zouming Xu, Beijing, CN;
Xintao Wu, Beijing, CN;
Zhi Jin, Beijing, CN;
Tao Luo, Beijing, CN;
Ningyu Luo, Beijing, CN;
Tingwei Han, Beijing, CN;
Hefei BOE Ruisheng Technology Co., Ltd., Hefei, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
A wiring substrate includes a substrate, at least one conductive layer located on a side of the substrate, and a protective layer located on a side of the at least one conductive layer. A conductive layer includes a plurality of pad groups, and a pad group includes a plurality of conductive pads. The protective layer includes a plurality of openings; a portion of the conductive layer exposed by an opening is a conductive pad. A maximum dimension of the conductive pad in a direction parallel to the substrate is greater than or equal to 1.5 times a minimum distance between an edge of the conductive pad and an edge of the conductive layer, and less than or equal to 30 times the minimum distance between the edge of the conductive pad and the edge of the conductive layer.