Probe assembly with downward-protruding probe shield and methods of operating the same

Abstract

A test apparatus includes a probe assembly, which includes: a multilayer structure including probe contact pads; an upper guide plate including an array of upper holes therethrough; a lower guide plate including an array of lower holes therethrough; a dielectric spacer plate located between the upper guide plate and the lower guide plate and including an opening; and an array of probes attached to the probe contact pads, vertically extending through the upper guide plate, the lower guide plate, and the dielectric spacer plate. The lower guide plate includes a downward-protruding portion having a first laterally-extending segment having a first width, and further includes a base portion overlying the downward-protruding portion and having a wider second width. The downward-protruding portion can be used to protect the array of probes while probing test pads on a wafer that are exposed between neighboring semiconductor dies.