The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Jul. 14, 2023
Applicant:

Tda Research, Inc, Wheat Ridge, CO (US);

Inventors:

Joshua R Biller, Evergreen, CO (US);

David Long, Golden, CO (US);

Bradley Spatafore, Westminster, CO (US);

Kevin Finch, Lakewood, CO (US);

Assignee:

TDA Research, Inc., Golden, CO (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/82 (2006.01);
U.S. Cl.
CPC ...
G01N 27/82 (2013.01);
Abstract

A device and a method of using the device to detect flaw and defects in carbon fiber laminates. The device contains an electromagnetic inductive coupling flaw detection for carbon fiber laminates with an excitor-detector operated with alternating current, an impedance matched RLC circuit and a vector-network-analyzer. The device can generate a 2-dimensional or a 3-dimensional representation to indicate a flaw location in a carbon fiber laminate.


Find Patent Forward Citations

Biller, Joshua. (2026). Electromagnetic inductive coupling analysis (emica) for on-board or in-lab detection of defects in thick or thin carbon fiber laminates (U.S. Patent No. 12748074). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12748074

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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