The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Feb. 27, 2023
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Shinzo Ishibe, Oizumi-machi, JP;
Takashi Noma, Ota, JP;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
Implementations of a method of forming an over pad metallization structure may include providing a semiconductor substrate including a plurality of copper pads on a first side of the semiconductor substrate; electroless plating an over pad metallization including nickel, palladium, and gold onto each copper pad of the plurality of copper pads; and patterning a layer of photoresist onto the over pad metallization of each copper pad of the plurality of copper pads. The method may include forming a mold compound over the plurality of copper pads, the over pad metallization, and the layer of photoresist of each copper pad; removing a portion of the mold compound and a portion of the layer of photoresist of each copper pad of the plurality of copper pads; and removing the layer of photoresist to expose the over pad metallization of each copper pad of the plurality of copper pads.