The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Jun. 22, 2023
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Tae Yong Lee, Gyeonggi-do, KR;

Min Won Park, Incheon, KR;

Jeong Hyun Yang, Seoul, KR;

Bo Yoon Yoo, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/56 (2006.01); H10W 20/42 (2026.01); H10W 42/20 (2026.01); H10W 44/20 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 20/42 (2026.01); H10W 42/20 (2026.01); H10W 74/019 (2026.01); H10W 74/117 (2026.01); H10W 44/248 (2026.01); H10W 90/724 (2026.01);
Abstract

In one example, an electronic device comprises a first substrate comprising a first dielectric structure and a first conductive structure, a first interconnect structure over an inward side of the first substrate and coupled with the first conductive structure, a first encapsulant over the inward side of the first substrate and contacting a lateral side of the first interconnect structure, a second substrate over the first encapsulant and comprising a second dielectric structure and a second conductive structure, wherein the second conductive structure is coupled with the first interconnect structure, and a first electronic component coupled with an outward side of the first substrate. The first electronic component is coupled with the second conductive structure via the first interconnect structure and the first conductive structure. Other examples and related methods are also disclosed herein.


Find Patent Forward Citations

Lee, Tae. (2026). Electronic devices and methods of manufacturing electronic devices (U.S. Patent No. 12745646). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12745646

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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