The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Aug. 18, 2023
Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;
Ruoyang Du, Dongguan, CN;
Zhen Lv, Shanghai, CN;
Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;
Abstract
A power semiconductor module, a motor driver and a method for manufacturing a power semiconductor module. A thermal conductive layer is disposed between a heat sink and a power semiconductor package, where the thermal conductive layer is a thermal conductive material having metal bonding wires on a surface, or is a solid-state thermal conductive layer formed by curable silicone grease, so that both the power semiconductor package and the heat sink are combined with the thermal conductive layer to form the power semiconductor module, thereby reducing a risk of damage caused by stress generated by the power semiconductor module in a process of assembling the entire motor driver. This implements helium inspection of the power semiconductor module in advance, improves a qualification rate of secondary processing of the entire motor driver.