The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Jul. 27, 2022
Tokyo Electron Limited, Tokyo, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes acquiring layer information of the combined substrate; forming a non-bonding region in which bonding strength between the first substrate and the second substrate is reduced, by radiating laser light in a pulse shape to a laser absorption film formed at an interface between the first substrate and the second substrate; and separating the first substrate from the second substrate. In the forming of the non-bonding region, a temperature difference between a first temperature in a laser radiation direct region including one light-converging point of the laser light and a second temperature in a laser radiation peripheral region is changed based on at least one of the acquired layer information or a position of the one light-converging point in the combined substrate in a radial direction.