The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Apr. 12, 2024
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Peter Delia, Albany, NY (US);
Ronald Nasman, Albany, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 70/00 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0414 (2026.01); H10P 70/20 (2026.01); H10P 72/0406 (2026.01); H10P 72/0408 (2026.01); H10P 70/15 (2026.01); H10P 70/56 (2026.01);
Abstract
A wafer processing method and system are provided. The wafer processing system includes a controller configured to control a dispense nozzle of the wafer processing system to dispense distilled IPA liquid onto a semiconductor wafer in a processing space between two plates of the wafer processing system. The controller is further configured to control one or more heating elements of one of the two plates to heat the one of the two plates to vaporize the distilled IPA liquid into IPA vapor, and control the dispense nozzle to dispense a gas into the processing space to dry the semiconductor wafer.