The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Oct. 26, 2023
Applicant:

Winbond Electronics Corp., Taichung City, TW;

Inventors:

Bo-Lun Wu, Taichung City, TW;

PO-Yen Hsu, Taichung City, TW;

Tse-Mian Kuo, New Taipei City, TW;

Assignee:

WINBOND ELECTRONICS CORP., Taichung City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/30 (2023.01);
U.S. Cl.
CPC ...
H10B 43/30 (2023.02);
Abstract

A method of forming a memory structure is provided. The method includes providing a substrate, wherein the substrate has a plurality of isolation structures, and the isolation structures include a plurality of first protrusions protruding above the substrate; replacing the first protrusions with a plurality of second protrusions to define a plurality of predetermined regions of floating gates between the second protrusions. The replacing step includes forming an insulation filling material between the first protrusions and on the substrate, and performing a patterning process to the insulation filling and the first protrusions to form second protrusions to define the predetermined regions of the floating gates, and forming a plurality of floating gates in the predetermined regions of the floating gates.


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