The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Feb. 17, 2022
Applicant:
Ebara Corporation, Tokyo, JP;
Inventor:
Keisuke Namiki, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/205 (2013.01);
Abstract
The present invention relates to a polishing pad and a polishing apparatus for use in polishing of a substrate, such as a wafer. Further, the present invention relates to a method of polishing a substrate, such as a wafer. At least a part of the polishing pad () is made of a light transmissive material () and a light reactive material (). The light reactive material () is mixed into the light transmissive material ().