The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 29, 2022
Canon Kabushiki Kaisha, Tokyo, JP;
Anshuman Cherala, Austin, TX (US);
Mario Johannes Meissl, Austin, TX (US);
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
A method can include applying a first controlled thickness layer over a first die substrate; attaching a first support substrate to the first controlled thickness layer to form a first sandwich structure; and singulating the first sandwich structure to form a plurality of first die structures, including a particular first die structure. The method can include attaching the particular first die structure to a transfer substrate, wherein the transfer substrate includes a particular second die structure that includes a particular second die. The particular second die has an average thickness different as compared to a particular first die within the particular first die structure. The method includes bonding the particular first die structure to a particular third die. After bonding, the upper surfaces of the particular first and second die structures are within a tolerance of being coplanar. An apparatus can be designed to carry out the method.