The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

May. 31, 2023
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventor:

Ki Yeul Yang, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/10 (2026.01); H10W 70/60 (2026.01); H10W 74/01 (2026.01); H10W 74/43 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01); H10W 90/10 (2026.01);
U.S. Cl.
CPC ...
H10W 74/147 (2026.01); H10W 74/014 (2026.01); H10W 74/019 (2026.01); H10W 74/141 (2026.01); H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 74/43 (2026.01); H10W 74/47 (2026.01); H10W 74/473 (2026.01); H10W 90/10 (2026.01);
Abstract

In one example, an electronic device can include a first electronic component and a second electronic component adjacent the first electronic component. A buffer block can be disposed between the first electronic component and the second electronic component. An encapsulant can be disposed on the first electronic component, the second electronic component, and the buffer block. A side of the buffer block can be substantially flat and coplanar with a side of the encapsulant. A redistribution structure can be disposed over the side of the encapsulant and the side of the buffer block. Other examples and related methods are also disclosed herein.


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