The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Mar. 09, 2023
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Yasutaka Nakashiba, Tokyo, JP;

Hiroshi Miyaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 44/00 (2026.01); H10W 70/05 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 70/652 (2026.01);
U.S. Cl.
CPC ...
H10W 44/501 (2026.01); H10W 70/05 (2026.01); H10W 70/09 (2026.01); H10W 70/093 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/016 (2026.01); H10W 74/019 (2026.01); H10W 74/114 (2026.01); H10W 70/6528 (2026.01);
Abstract

A semiconductor device includes a first semiconductor chip, a second semiconductor chip, and a redistribution layer. The first semiconductor chip and the second semiconductor chip are arranged spaced apart from each other in a second direction orthogonal to a first direction. The redistribution layer is disposed across over the first semiconductor chip and the second semiconductor chip. The redistribution layer includes a first inductor and a second inductor. The first inductor and the second inductor are spaced apart and face each other in a third direction orthogonal to the first direction and the second direction. The first inductor and the second inductor are electrically connected to the first semiconductor chip and the second semiconductor chip, respectively. The first inductor and the second inductor are wound across over the first semiconductor chip and the second semiconductor chip in a plane orthogonal to the third direction.


Find Patent Forward Citations

Nakashiba, Yasutaka. (2026). Semiconductor device (U.S. Patent No. 12740429). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12740429

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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