The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jul. 29, 2022
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Hsin-Yu Chen, Kaohsiung, TW;

Huei-Shyong Cho, Kaohsiung, TW;

Shih-Wen Lu, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 70/611 (2026.01); H10W 70/614 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01); H10W 90/401 (2026.01); H10W 90/701 (2026.01); H10W 70/60 (2026.01); H10W 90/724 (2026.01);
Abstract

The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.


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