The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jun. 14, 2023
International Business Machines Corporation, Armonk, NY (US);
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Brent A. Anderson, Jericho, VT (US);
Ruilong Xie, Niskayuna, NY (US);
Albert M. Chu, Nashua, NH (US);
Reinaldo Vega, Mahopac, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor structure with a first backside metal level that has a plurality of first type of lines and at least one second type line. The first type of lines have a wider top surface than the bottom surface and have a first width. The first type of lines each connect by a first via to a second backside metal level. Each of first type of lines and the second type line connect by a second via to a through-silicon via. The second type line is narrower than the first type of lines. Each of the second type line is between adjacent first type of lines. The second type line has a top surface that is in the middle of the first type of lines, below the first type of lines, above, or level with the top surface of the first type of lines.