The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Sep. 21, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Brent A. Anderson, Jericho, VT (US);
Albert M. Chu, Nashua, NH (US);
Reinaldo Vega, Mahopac, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/00 (2026.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/056 (2026.01); H10W 20/082 (2026.01); H10W 20/085 (2026.01); H10W 20/435 (2026.01);
Abstract
An interconnect structure for connecting an upper wiring line to a lower wiring line includes a via connecting a lower portion of the upper wiring line with an upper surface of the lower wiring line and a wrap-around via portion formed integrally with the via, the wrap-around portion extending along and electrically contacting a portion of the sides of the lower wiring line.