The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 27, 2022
Yangtze Memory Technologies Co., Ltd., Wuhan, CN;
Wenli Di, Wuhan, CN;
YANGTZE MEMORY TECHNOLOGIES CO., LTD., Wuhan, CN;
Abstract
Implementations of the present disclosure provides a wafer bonding method and system. The method comprises: providing a bonding relation which is used to indicate bonding between at least two wafer lots; acquiring basic information of wafer lots corresponding to the bonding relation according to the bonding relation; performing a first rule check on the basic information, and conveying the wafer lots to a bonding station after the check passes; updating the basic information of the wafer lots conveyed to the bonding station to obtain updated basic information; performing a second rule check on the updated basic information, and performing wafer bonding on the wafer lots conveyed to the bonding station according to the bonding relation after the check passes.