The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Apr. 14, 2022
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Katsuaki Masaki, Kyoto, JP;
Takeshi Kamikawa, Kyoto, JP;
Toshihiro Kobayashi, Kyoto, JP;
Yuichiro Hayashi, Kyoto, JP;
Yuki Taniguchi, Kyoto, JP;
Yuta Aoki, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/20 (2026.01); H10P 14/24 (2026.01); H10P 52/00 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10P 14/3416 (2026.01); H10P 14/24 (2026.01); H10P 52/00 (2026.01); H10W 20/042 (2026.01);
Abstract
A main substrate, a seed portion (SD) located higher than the main substrate, and first and second semiconductor parts (F andS) arranged side by side in a first direction (Y direction) are provided. The first and second semiconductor parts are in contact with the seed portion, a longitudinal direction of the seed portion (SD) is the first direction (Y direction), and a hollow portion (VD) is located between the main substrate () and each of the first semiconductor part and the second semiconductor part.