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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12740348 B1

PDFFull Text
Date of Patent:
Sep. 15, 2026

Filed:

Apr. 14, 2022

Semiconductor substrate, manufacturing method and manufacturing apparatus for semiconductor substrate, semiconductor device, manufacturing method and manufacturing apparatus for semiconductor device, and electronic device

Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Katsuaki Masaki, Kyoto, JP;

Takeshi Kamikawa, Kyoto, JP;

Toshihiro Kobayashi, Kyoto, JP;

Yuichiro Hayashi, Kyoto, JP;

Yuki Taniguchi, Kyoto, JP;

Yuta Aoki, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Mouloucoulaye Inoussa

Int. Cl.
CPC ...
H10P 14/20 (2026.01); H10P 14/24 (2026.01); H10P 52/00 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10P 14/3416 (2026.01); H10P 14/24 (2026.01); H10P 52/00 (2026.01); H10W 20/042 (2026.01);
Abstract

A main substrate, a seed portion (SD) located higher than the main substrate, and first and second semiconductor parts (F andS) arranged side by side in a first direction (Y direction) are provided. The first and second semiconductor parts are in contact with the seed portion, a longitudinal direction of the seed portion (SD) is the first direction (Y direction), and a hollow portion (VD) is located between the main substrate () and each of the first semiconductor part and the second semiconductor part.

Find Patent Forward Citations

Masaki, Katsuaki. (2026). Semiconductor substrate, manufacturing method and manufacturing apparatus for semiconductor substrate, semiconductor device, manufacturing method and manufacturing apparatus for semiconductor device, and electronic device (U.S. Patent No. 12740348). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12740348

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