The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Feb. 13, 2023
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Assignee:
QUALCOMM INCORPORATED, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 80/00 (2026.01); H01L 25/16 (2023.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H10W 90/00 (2026.01); H10W 90/401 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01);
Abstract
Disclosed is a stacked substrate package that incorporate surface mounted devices (SMD) between the base and interposer substrates. The SMDs, which may be passive devices (e.g., capacitor, inductor, resistor, etc.), may be electrically coupled to power distribution routing layers of the base and/or the interposer substrates. In this way, clean power may be provided to the devices (e.g., SoC dies, memory dies, etc.) of the stacked substrate package.