Capacitorless 3d stacked dram device and manufacturing method thereof

Abstract

The present disclosure discloses a capacitorless three-dimensional stacked DRAM device including a plurality of memory cell structures spaced apart from each other in horizontal and vertical directions, each of the plurality of memory cell structures including a horizontal read transistor structure and a horizontal write transistor structure, a plurality of write bit lines connected to the plurality of write transistor structures of the plurality of memory cell structures and extending in the horizontal direction, a plurality of read bit lines connected to the plurality of read transistor structures of the plurality of memory cell structures and extending in the horizontal direction, a plurality of write word lines connected to the plurality of write transistor structures and extending in the vertical direction, and a plurality of read word lines connected to the plurality of read transistor structures and extending in the vertical direction.