The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Nov. 18, 2024
Micron Technology, Inc., Boise, ID (US);
Tawalin Opastrakoon, Boise, ID (US);
Sean Brasfield, Boise, ID (US);
Chonggiap Chiew, Singapore, SG;
MICRON TECHNOLOGY, INC., Boise, ID (US);
Abstract
A technique is disclosed for cycling replacement blocks based on die wafer location data. The die wafer location data can provide a die location failure value for each die of a memory device. Each die location failure value can indicate a likelihood of die failure during operation of the memory device. A die of the memory device can be identified as a high-risk die corresponding to a die of the memory device as most likely to experience a die failure based on the die wafer location data. One or more reserved blocks of the high-risk die can be identified. The reserved blocks of the high-risk die can be cycled.