The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Nov. 10, 2020
Shengyi Technology Co., Ltd., Guangdong, CN;
Weifeng Yin, Guangdong, CN;
Qianfa Liu, Guangdong, CN;
Jianying Shi, Guangdong, CN;
Jiangling Zhang, Guangdong, CN;
Sha Li, Guangdong, CN;
Songgang Chai, Guangdong, CN;
Yongjing Xu, Guangdong, CN;
Cui Huo, Guangdong, CN;
SHENGYI TECHNOLOGY CO., LTD., Guangdong, CN;
Abstract
A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55° C. to 150° C. is 0-1000 ppm/° C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.