The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Jul. 06, 2023
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Gi Tae Lim, Seoul, KR;

Wook Choi, Incheon, KR;

Seul Bee Lee, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/05 (2026.01);
U.S. Cl.
CPC ...
H10W 90/701 (2026.01); H10W 70/092 (2026.01);
Abstract

In one example, an electronic device can comprise a first substrate, an electronic component disposed over a side of the first substrate, and a vertical interconnect coupled to the side of the first substrate. The vertical interconnect can comprise a first metallic core ball proximate the first substrate, a second metallic core ball disposed above the first metallic core ball and distal from the first substrate, and a fusible material coupling the first metallic core ball with the second metallic core ball. The fusible material can be coupled to the first substrate. A second substrate can be disposed over the electronic component and the vertical interconnect. The fusible material of the vertical interconnect can be coupled to the second substrate. Other examples and related methods are also disclosed herein.


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