Three-dimensional (3d) integrated circuit (ic) (3dic) package employing a redistribution layer (rdl) interposer facilitating semiconductor die stacking, and related fabrication methods

Abstract

Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die ('die'), and related fabrication methods. The 3DIC package includes an RDL interposer that has one or more RDL metallization layers formed adjacent to a first, bottom die(s). A second, top die(s) is stacked on the RDL interposer. The RDL interposer provides an extended die area that the top die can be coupled so that the fabrication process of the 3DIC package is independent die sizes. The bottom die(s) can be singulated and disposed in an RDL metallization layer(s) as part of a reconstituted RDL interposer regardless of whether the top die(s) is greater than or less than the size of the bottom die(s). Also, the RDL interposer being the substrate in which the bottom die(s) is disposed and top die(s) is coupled provides efficient signal routing paths to the top and bottom dies.