The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Aug. 08, 2023
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Sang Hyun Jin, Incheon, KR;

Hyun Goo Cha, Incheon, KR;

Yun Kyung Jeong, Incheon, KR;

Jin Suk Jeong, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 70/05 (2026.01); H10W 70/66 (2026.01); H10W 70/685 (2026.01); H10W 70/695 (2026.01); H10W 74/10 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 70/05 (2026.01); H10W 70/095 (2026.01); H10W 70/66 (2026.01); H10W 70/685 (2026.01); H10W 70/695 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 90/401 (2026.01); H10W 90/701 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01); H10W 90/794 (2026.01);
Abstract

In one example, a semiconductor device comprises a first dielectric comprising a first side and a second side, a first conductive tier in the first dielectric and comprising a first conductive path integral with a first conductive via, wherein the first conductive path and the first conductive via extend between the first side and the second side of the first dielectric, a second dielectric comprising a first side and a second side, and a first barrier covering the first conductive tier and covering the first dielectric, wherein the first barrier is between the second side of the first dielectric and the first side of the second dielectric. The first conductive tier comprises a trench barrier coupled with the first dielectric structure. Other examples and related methods are also disclosed herein.


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