The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jan. 28, 2022
Applicant:
Fuji Electric Co., Ltd., Kawasaski, JP;
Inventors:
Masaaki Tachioka, Matsumoto-city, JP;
Takashi Saito, Matsumoto-city, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H10W 40/25 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/255 (2026.01); H10W 74/114 (2026.01); H10W 72/325 (2026.01); H10W 72/352 (2026.01); H10W 72/353 (2026.01); H10W 72/884 (2026.01); H10W 90/736 (2026.01);
Abstract
An object is to provide highly reliable semiconductor element bonding portion and semiconductor device that have high heat resistance and improved adhesion between a bonding material and a sealing resin. Provided is a semiconductor element bonding portion in which the semiconductor elementand an electrically conductive plateare bonded to each other by a bonding layerand the bonding layerincludes a metal nanoparticle sintered bodyand a coupling agentincluding an SH group.