The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Aug. 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Cheng-Lung Wu, Miaoli County, TW;
Yi-Fam Shiu, Miaoli County, TW;
Yang-Ann Chu, Hsinchu City, TW;
Hsu-Shui Liu, Pingjhen City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD, Hsinchu, TW;
Abstract
The present disclosure provides an embodiment of a semiconductor fabrication system. The semiconductor fabrication system includes an equipment front end module with a load port to transfer semiconductor wafers to the equipment front end module from a wafer carrier; and a wafer humidity control device embedded in the equipment front end module and configured to generate an air curtain to protect the semiconductor wafers. The wafer humidity control device further includes a gas entry layer with a gas inlet to receive a gas; a uniform layer integrated with the gas entry layer and designed to redistribute the gas; and a diversion structure having multiple pieces assembled together to hold the uniform layer and integrated with the gas entry layer.