The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Mar. 02, 2021
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Hayato Tanoue, Kikuchi-gun, JP;
Yohei Yamashita, Kikuchi-gun, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 34/42 (2026.01); B23K 26/062 (2014.01); B23K 26/53 (2014.01); H10P 72/00 (2026.01); H10P 95/00 (2026.01);
U.S. Cl.
CPC ...
H10P 34/42 (2026.01); H10P 72/0436 (2026.01);
Abstract
A substrate processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other is provided. A laser absorption layer is formed on the second substrate. The substrate processing method includes forming a separation modification layer by radiating a laser beam to the laser absorption layer in a pulse shape to accumulate a stress in the laser absorption layer; and separating the second substrate by releasing the accumulated stress in a chain manner.