The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Feb. 01, 2024
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Naoyuki Ohse, Matsumoto-city, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/832 (2025.01); H10D 12/01 (2025.01); H10D 30/01 (2025.01); H10D 30/66 (2025.01); H10D 62/13 (2025.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H10D 62/8325 (2025.01); H10D 12/031 (2025.01); H10D 30/0297 (2025.01); H10D 30/668 (2025.01); H10D 62/153 (2025.01); H10D 64/513 (2025.01);
Abstract

A silicon carbide semiconductor device includes: a drift layer of a first conductivity-type; a base region of a second conductivity-type provided on a top surface side of the drift layer; a source contact region of the first conductivity-type including silicon carbide having a 3C-structure provided on a top surface side of the base region; a gate electrode buried inside a gate trench with a gate insulating film interposed; a main electrode buried inside a contact trench so as to be in contact with a side surface of the source contact region; and a base contact region of the second conductivity-type including silicon carbide having a 4H-structure so as to be in contact with a bottom surface of the contact trench, wherein the bottom surface of the contact trench is located at a position deeper than a bottom surface of the source contact region.


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