The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Jan. 26, 2023
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Noriaki Yao, Matsumoto-city, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 62/10 (2025.01); H10D 30/01 (2025.01); H10D 62/17 (2025.01); H10P 30/22 (2026.01);
U.S. Cl.
CPC ...
H10D 62/111 (2025.01); H10D 30/0291 (2025.01); H10D 62/393 (2025.01); H10P 30/22 (2026.01);
Abstract

A superjunction semiconductor device has: a semiconductor substrate of a first conductivity type; a buffer layer of the first conductivity type, provided on a front surface of the semiconductor substrate and having an impurity concentration lower than that of the semiconductor substrate; a drift layer of the first conductivity type, provided on the buffer layer and having an impurity concentration lower than that of the buffer layer; and a parallel pn structure having first column regions of the first conductivity type and second column regions of a second conductivity type repeatedly alternating one another in a direction parallel to the front surface. A subset of the first and second column regions are located in a termination structure portion and have depths that become shallower stepwise towards an end of the semiconductor substrate, where the second column regions are provided with bottoms thereof in the drift layer.


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