The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Aug. 29, 2022
Honor Device Co., Ltd., Shenzhen, CN;
HONOR DEVICE CO., LTD., Shenzhen, CN;
Abstract
Disclosed are a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method includes: covering a periphery of an electronic element with a heat dissipation cover, where the heat dissipation cover is provided with a through hole, and an inner wall of the heat dissipation cover is provided with a plurality of electrodes; injecting a liquid metal through the through hole into an accommodating cavity enclosed by the substrate and the heat dissipation cover until the entire accommodating cavity is filled, and during this period, energizing the electrodes, so that a current flows through the liquid metal to reduce surface tension of the liquid metal; and sealing the through hole.