The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Sep. 14, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tejung Huang, Miyagi, JP;

Shuhei Ogawa, Miyagi, JP;

Cedric Thomas, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 50/00 (2026.01); H10P 50/24 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32449 (2013.01); H01J 37/32082 (2013.01); H01J 37/32091 (2013.01); H01J 37/321 (2013.01); H01J 37/32137 (2013.01); H01J 37/32165 (2013.01); H10P 50/244 (2026.01); H10P 50/69 (2026.01); H01J 2237/334 (2013.01);
Abstract

A substrate processing method in a substrate processing apparatus includes (a) supplying a process gas that contains a gas containing halogen other than fluorine and a gas containing oxygen, to a processing container in which a stage is disposed, the stage being configured to place thereon a workpiece having an etching target film, (b) performing plasma processing on the workpiece by first plasma generated from the process gas under first plasma generation conditions, (c) performing plasma processing on the workpiece by second plasma generated from the process gas under second plasma generation conditions in which a condition of radio-frequency power and a processing time are different from those in the first plasma generation conditions, and other conditions are the same, and (d) repeating (b) and (c).


Find Patent Forward Citations

Huang, Tejung. (2026). Substrate processing method and substrate processing apparatus (U.S. Patent No. 12731765). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12731765

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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