The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Nov. 30, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Seokhyoung Hong, Nirasaki City, JP;
Tsuyoshi Takahashi, Nirasaki City, JP;
Taichi Monden, Nirasaki City, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/06 (2006.01); C23C 14/18 (2006.01); C23C 14/58 (2006.01); C23C 16/06 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 16/56 (2006.01); H10P 14/40 (2026.01); H10P 95/00 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
C23C 14/0641 (2013.01); C23C 14/18 (2013.01); C23C 14/5846 (2013.01); C23C 16/06 (2013.01); C23C 16/34 (2013.01); C23C 16/45525 (2013.01); C23C 16/56 (2013.01); H10P 14/418 (2026.01); H10P 95/00 (2026.01); H10W 20/048 (2026.01);
Abstract
A film forming method includes: providing the substrate into the processing container; forming a metal-based film on the substrate within the processing container; and subsequently, supplying a Si-containing gas into the processing container in a state in which the substrate is provided within the processing container.