The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Oct. 19, 2021
Applicants:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Taiwan Semiconductor Manufacturing CO Ltd, Hsinch, TW;

Inventors:

Haruhiko Terada, Kanagawa, JP;

Tseng Kuo-Chyuan, Hsinch, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H10B 63/00 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/5226 (2013.01); H10B 63/20 (2023.02);
Abstract

A semiconductor device according to an embodiment of the present disclosure includes: a first memory cell layer including a first selection line extending in a first direction, a second selection line extending in a second direction, and a first memory cell coupled to the first selection line and the second selection line; a second memory cell layer provided above the first memory cell layer, and including a third selection line extending in the first direction, a fourth selection line extending in the second direction, and a second memory cell coupled to the third selection line and the fourth selection line; and a first wiring layer provided between the first memory cell layer and the second memory cell layer and including a first metal wiring line.


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