The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Apr. 24, 2024
Disco Corporation, Tokyo, JP;
Tomoharu Takita, Tokyo, JP;
Hayato Kiuchi, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer processing method for processing a wafer which has one side in which a circular recessed portion is formed in a region surrounded by an annular protruding portion is performed by a thermocompression bonding apparatus including a first recessed portion, a second recessed portion, and a holding table that is disposed on the second recessed portion. In the method, the wafer the one side of which is oriented upward is held from a lower side by the holding table, a sheet is sandwiched by the first recessed portion and the second recessed portion, the first recessed portion is depressurized while the second recessed portion is depressurized, pressure inside the first recessed portion is increased, the sheet is caused to come into contact with the one side of the wafer, and the sheet is heated, to thermocompression-bond the sheet to the one side of the wafer.