The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Feb. 15, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chi-Wen Chiu, Hsinchu, TW;
Chih-Chang Wu, Hsinchu City, TW;
Che-Wei Tung, Hsinchu, TW;
Chiang Hsien Shih, Hsinchu, TW;
Chin-Szu Lee, Taoyuan City, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/448 (2006.01); C23C 16/455 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
C23C 16/4481 (2013.01); C23C 16/45561 (2013.01); H10P 72/0602 (2026.01);
Abstract
A system and method for reducing thermal transfer in a dual ampoule system. The dual ampoule system includes a first ampoule, a second ampoule, and a planar heat shield. The planar heat shield is positioned between the first ampoule and the second ampoule, where the planar heat shield is configured to resist thermal transfer between the first ampoule and the second ampoule.