Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side, and a substrate conductive structure. The substrate conductive structure includes a grounded path and a powered path. An electronic component is coupled to the substrate top side. An encapsulant covers the electronic component and the substrate top side. The encapsulant includes apertures and the powered path is exposed by the apertures. A first network structure includes a first network cover over the encapsulant. and first network interconnects coupled to the first network cover and the powered path through the apertures. A second network structure includes a second network cover having a second cover ceiling and second cover sidewalls extending from the second cover ceiling; and a second network contact coupled to the second network cover and the grounded path. The second network cover is over the first network cover and the first network cover is over the first electronic device. Other examples and related methods are also disclosed herein.