The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Nov. 22, 2022
Google Llc, Mountain View, CA (US);
Horia Alexandru Toma, Sunnyvale, CA (US);
Zuowei Shen, Los Altos, CA (US);
Hong Liu, Palo Alto, CA (US);
Yujeong Shim, Cupertino, CA (US);
Biao He, Sunnyvale, CA (US);
Jaesik Lee, San Jose, CA (US);
Georgios Konstadinidis, San Jose, CA (US);
Teckgyu Kang, Saratoga, CA (US);
Igor Arsovski, Williston, VT (US);
Sukalpa Biswas, Fremont, CA (US);
Google LLC, Mountain View, CA (US);
Abstract
The technology generally relates to disaggregating memory from an application specific integrated circuit ('ASIC') package. For example, a high-bandwidth memory (“HBM”) optics module package may be connected to an ASIC package via one or more optical links. The HBM optics module package may include HBM dies(s), HBM chiplet(s) and an optical chiplet. The optical chiplet may be configured to connect the HBM optics module to one or more optical fibers that form an optical link with one or more other components of the ASIC package. By including an optical chiplet in the HBM optics module package, the HBM optics module package may be disaggregated from an ASIC package.