The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Dec. 23, 2021
Applicants:
Adel A. Elsherbini, Tempe, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Inventors:
Adel A. Elsherbini, Tempe, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 70/692 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/635 (2026.01); H10W 70/65 (2026.01); H10W 70/692 (2026.01); H10W 90/00 (2026.01);
Abstract
Embodiments disclosed herein include die modules, electronic packages, and systems. In an embodiment, a die module comprises a first substrate and a first die over the first substrate. In an embodiment, the die module further comprises a second die over the first substrate adjacent to the first die. In an embodiment, the die module further comprises a via module through the first substrate. In an embodiment, the via module comprises a second substrate, where the second substrate comprises glass, and a via through the second substrate.