The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Oct. 02, 2023
Stmicroelectronics International N.v., Geneva, CH;
Florian Perminjat, Saint Romans, FR;
Fabrice De Moro, Saint Verand, FR;
STMicroelectronics International N.V., Geneva, CH;
Abstract
An integrated circuit package includes a support substrate with front connection pads on a front surface thereof and rear connection pads on a rear surface thereof. An integrated circuit device is mounted to the support substrate in flip chip orientation with a front face of the integrated circuit device facing the front surface of the support substrate. A thermally conductive heat spreader is mounted adjacent a rear face of the integrated circuit device. External direct thermal paths thermally couple a top surface of the thermally conductive heat spreader to the rear surface of the support substrate. Each external direct thermal path includes a first portion on and in direct contact with thermally conductive heat spreader, a second portion on and in direct contact with an external side surface of the support substrate and a third portion on and in direct contact with the rear surface of the support substrate.