The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jan. 17, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Toshiaki Kodama, Yamanashi, JP;

Takeshi Niidome, Yamanashi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/30 (2026.01); G01J 5/48 (2022.01); H10P 72/00 (2026.01); H10P 72/50 (2026.01);
U.S. Cl.
CPC ...
H10P 72/3411 (2026.01); G01J 5/48 (2013.01); H10P 72/0464 (2026.01); H10P 72/0602 (2026.01); H10P 72/3402 (2026.01); H10P 72/53 (2026.01);
Abstract

A substrate processing system is provided with: a substrate processing apparatus including a loading/unloading port for a substrate and configured to execute predetermined processing on the substrate; a transfer device connected to the substrate processing apparatus via an opening/closing mechanism configured to open/close the loading/unloading port, and including a substrate transfer mechanism configured to load and unload the substrate into and from the substrate processing apparatus via the loading/unloading port; a thermal image generator provided on the substrate transfer mechanism and configured to generate a thermal image; and a control device. The control device is configured to: open, by the opening/closing mechanism, the loading/unloading port at a time at least either before or after the substrate processing apparatus executes the predetermined processing; and generate, by the thermal image generator, an in-apparatus thermal image as the thermal image indicating a temperature distribution inside the substrate processing apparatus.


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